Thanks Hans,
Great kit with excellent support. I look forward to the firmware updates in due course, appreciating that they take time to develop and test.
As an aside I do wonder if you considered adding thermal reliefs on the ground plane connections (on all layers). From experience they make reliable soldering (and a better chance of successful rework) much easier. I would have thought that the tiny increase in inductance would be insignificant at HF.
73 Trevor G6PSZ
