If you look closely at it with some optical magnification you'll see that there already are thermals. And they're on all layers. Just that with 6 layers and thermals every 90° that means up to 24 thermals per ground point.?
73 Hans G0UPL
On Thu, Sep 26, 2024, 16:42 Trevor Shackleton via <trevorshackleton=[email protected]> wrote:
Great kit with excellent support. I look forward to the firmware updates in due course, appreciating that they take time to develop and test.
As an aside I do wonder if you considered adding thermal reliefs on the ground plane connections (on all layers). From experience they make reliable soldering (and a better chance of successful rework) much easier. I would have thought that the tiny increase in inductance would be insignificant at HF.