Hello,
I¡¯m trailing designing a new PCB from M0HYT¡¯s Ubitx.
The copper side where the components were (No SMD, only components with through holes) had few tracks but a maximumground.
The rear face where the components were welded, there were only tracks? and no ground plan.
If I keep the same type of component layout, then it will be more advantageous to put the SMD components on the back side of the PCB (Where there are the most tracks) and the hole components on the classic side.
My question: Keep the ground? on the side of the components with holes??Move it on the side of the SMD components???Put one on each side and connect it with holes???Which placement for the ground holes (EX: 1 every cm?)
Question for a specialist RF ground? ?design. LOL
Some id¨¦as?
cdt