The IR preheats the board to 150 to 200 degrees C, not at the melting point of solder.? It minimizes the thermal shock on the top chips.? It also minimizes the amount of heat needed to get the BGA chip off.? There's a definite limit for how long all this should take.? You should have a shroud to fit the BGA chip, helps minimize heat on other parts.? Be careful with the air flow, you can blow off small parts (don't ask).? The entire chip needs to be heated, unlike TQFP parts which only need the edges heated. (obvious, but thought I'd mention it).
Definitely not an expert here.
Harvey
toggle quoted message
Show quoted text
On 1/13/2023 1:57 PM, Paul Carew via groups.io wrote:
"..I'd try reflow first. You have the equipment for that?"
I have a 'Hot Air' station and I just purchased a T862++ IR station, but no experience yet with IR.
We'll see. It's a pretty dense board, with lots of close proximity connectors etc.....lots of opportunity for messing up :-)
