On Wed, Apr 2, 2025 at 02:08 AM, Rainer Hantsch wrote:
But - honestly - hot air is definitely the better choice.???? -> I am talking of a hot air reflow workstation, not a hot-air-gun from supermarket.
Applying background heat to the PCB helps in using lower temperatures and reduces thermal stresses on the board and components.
Low-melting point solders like Chip-Quik also have their place in your rework arsenal.?
I use the paste; a surprisingly-small amount (tip of toothpick, heaping it on just makes a mess) will drastically lower the melting point of the solder, which just makes things much easier.
73, Don N2VGU
Donald S Brant Jr