Hi,
On 23/03/2022 16:19, Oz-in-DFW wrote:
On Tue, Mar 22, 2022 at 01:20 PM, Alan Pearce wrote:
This will allow the pads to produce the solder mask
for each individual pin without having a long strip of solder.
My guess is that they expect solder along the strip, either for
current capacity, thermal transfer, or both.
Correct, page 15 under "Layout Considerations" it says "Make sure
to minimize the solder joint resistance at these VDD pins by
applying solder along the whole length of the V DD bar[...]"
This entire section talks a lot about resistance, heat, thermal
vias, PCB layers, etc. Utterly fascinating stuff, I wish I would
understand it...
No, it was a lucky find on my part. Blind monkeys sometimes find
a banana too... ;-)
??? Konrad
