Re: PCB through hole activation for copper plating
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The problem was not lack of solder inside the eyelet, the component leads soldered fine with solder filling up the eyelet. It also soldered well to the bottom layer.
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Once the eyelet channel filled up with solder there was no motivation for it to flow further across and down over the edge to finally join the top layer of the PCB. The slit provided a path to reach the top layer without having to flow over the top. Bertho -----Original Message-----
From: [email protected] <[email protected]> On Behalf Of Donald H Locker Sent: Saturday, June 13, 2020 20:42 To: [email protected] Subject: Re: [homebrewpcbs] PCB through hole activation for copper plating More likely provided the capillary wick necessary for the solder to follow. With the plain barrel eyelets, the solder would have to wick up the center hole or between the eyelet and the substrate - one gap is too large and the other is too small (as well as having a non-wettable surface facing the eyelet.) The slit provides a wettable, narrow channel for the solder. Isn't surface tension wonderful! Donald. -- *Plain Text* email -- it's an accessibility issue () no proprietary attachments; no html mail /\ <> On 2020-06-13 4:40 p.m., Lee Studley wrote: @ Bertho: That's an very interesting note. Thanks for sharing that. I |
Bertho