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Re: PCB through hole activation for copper plating


 

More likely provided the capillary wick necessary for the solder to
follow. With the plain barrel eyelets, the solder would have to wick up
the center hole or between the eyelet and the substrate - one gap is too
large and the other is too small (as well as having a non-wettable
surface facing the eyelet.) The slit provides a wettable, narrow channel
for the solder.

Isn't surface tension wonderful!

Donald.
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On 2020-06-13 4:40 p.m., Lee Studley wrote:
@ Bertho: That's an very interesting note. Thanks for sharing that. I
wonder if the slit also broke some sort of surface tension at play to
help the solder get where it needed to go.

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