First you should worry about how your going to etch.
You read my mine this was my next question.
If you decide on
pattern plate then you have choice of tin or tin/lead metal resist.
If you
choose tin then you must use alkaline ammonia etch. If you choose
tin/lead
then can use sulfuric/peroxide, ammonium persulfate etch, or
ammonia etch.
Is this the same stuff called Liquid Tin by MG Chemicals and a
similar prodouct by Datak? Or would these get disolved by the etching
solution?
However, I would be wary on having toxic lead plating solutions
laying
around. For the ammonia etch it can be chloride or sulfate based. If
chloride based then you have major waste problems because the
copper cannot
be recovered easily (at least what I know) and you will need to
treat then
dump your solution ($$$).
This is like ferric chloride?
If you use sulfate based alkaline ammonia then
the etchant can be electrolytically regenerated although the
etching rate
is much slower than chloride.
PCB fabrication may look simple on a flow chart but when it comes to
actually making it work its a whole different story.
Please excuse my ignorance. I have a lot zeal and a lot to learn.
