So, as a bit more information (not all of it, obviously as you need to be security cleared for that!) I was thinking more of mainly increasing the thermal mass a little and perhaps trying to couple it to the case with a thermal pad or similar.
I have no real intention of using this unit for high duty cycle modes at the moment.
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I¡¯m aware of the intention that the tinned pad on the board is the majority of the heatsinking but having done a fair bit of design and dev work on small RF units myself I¡¯m all too aware that the mounting washer here provides the majority of the sink mass, with the pad and board structure also providing a good chunk. Given that the usual failure in the finals is through overheating, as a number of examples have shown, I intend to try to reduce that heat by sinking it a little better; replacing the washer with a better heatsinking arrangement will likely improve things.
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tra
Piggly
