I've successfully built several Q's. I use a 2mm conical tip on my WEP station at 400 C for just about everything. I have bumped the temp up to 480C to throw more heat quickly into large components like BNCs or other jack connectors.
I generally mentally count off about three to four seconds for most joints, after the solder is fully flowing into the leads and surrounding pads. Maybe a bit less for very fine pins.?
I might drop down to a 1mm conical at 400 C for sneaking into tight spaces especially on the topside for adding a bit of solder on topside components, to help mechanically stabilize toroids leads for instance.??
I drop down to a very fine 0.5mm tip only for touching up individual IC pins or small SMD work.?
I use good 60/40 or 63/37 fluxed solder.? Mostly 0.31 diameter but occasionally 0.15 for really fine work. Kester makes outstanding products.?
And ChipQuik brand liquid flux as needed and their low-temp solder paste for certain SMD rework.
GREG
On Tue, Nov 26, 2024 at 11:00 AM, Phill via groups.io
<rocinante2021@...> wrote:
Thanks Jerry, excellent advice. My QMX+ arrived today and I've already started with the build. I'm concerned about making good joints to the ground planes. I've done a couple of capacitors and I'm not happy with them. I'm using a Hakko 888D with a fine 0.5mm tip and extra flux. I can get the heat on the component lead but the pcb solder pad is really small. What temperature do you recommend to get a solid joint without frying everything.?
Kind regards
--
Phill EA5JHA
