On Sun, Aug 27, 2023 at 05:45 AM, Guido PE1NNZ wrote:
add excessive solder on both sides of the IC
The use of a low-melting point alloy such as ChipQuik will be a tremendous help in getting the solder to flow without excessive heat.?
I also use a #15 scalpel blade to cut the individual leads right at the package and remove them singly instead of trying to melt all 28 (or whatever) leads at once; leadless packages do not offer this option so the QhipQuik is even more helpful.? This is the process we used on hi-rel spacecraft boards as it was the safest for the boards, the ICs were sent for failure analysis or scrapped so trying to keep them intact was pointless.
Good stereo magnification is immensely helpful.
73, Don N2VGU
Donald S Brant Jr