I strongly recommend using a VERY thin layer of thermal paste between the BS170’s and the PCB. Mechanical surfaces are not perfectly flat - neither the flat of the FET package nor the board. A thin layer of paste fills in these microscopic gaps. Don’t glob the paste down as this will make things worse. Use something like a credit or debit card to gently scrape away excess paste for optimum heat transfer.
On Tue, Aug 22, 2023 at 10:29 AM Frank <
dc8fg@...> wrote:
Hi all,
I'm a little bit afraid to fry the finals when working in digimodes (long txing).
So, I wonder if there is any construction possible to dissipate the heat of the finals to bottom cover of the housing.
My idea is: a piece of copperplate soldere to a bolt which is connected with the washer which is on top of the finals.?
The copperplate must be in tight touch with the bottom of the housing.
What do you think?
73 Frank
