On Thu, Feb 29, 2024 at 09:13 PM, Heinz wrote:
I damaged two PUIs by slightly bending the wires away from the capsule surface.
yeah... with most electret capsules, you really have to avoid any kind of physical stress on those tiny solder-pads. It doesn't take much force at all to tear the metal pads off. For that thickness of mic wire, you need to trim up the ends carefully and solder those exactly where they need to be (no post-soldering bending!). Or preferably, solder some short lengths of thin, very flexible stranded wire to the capsules, then join the thin wires to your heavier wires. The thin wires are also easier to solder quickly to the capsule, so less risk of thermal damage to the capsule FET.
I've had good results so far with cheap fuzzy lav windscreens, but I haven't yet tested in heavier winds. I might try a combo of foam lav windscreens with a fuzzy on top of that.
Nice bamboo housings!
