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ok i just read your post on this and you stated that your issue occured after a processor board repair..... HP as mentioned before uses EEPROMs on each module to store calibration information , the

I am simply stating that for my unit showing same symptoms this “did clear the issue on my unit”. Sandra Sent: Wednesday, June 1, 2022 9:07 PM To: [email protected] Subject:

Might be a possibility , I have some silver filled solder paste that was intended to be used for die attach but I have to find the data sheet to see the thermal resistance Sent: Wednesday, June 1,

Usually the security sanitization requirement ONLY applies to user data which means every piece of data that was stored by the user it does NOT apply to factory data ! What this means in real life is

Going from memory is not always the best thing, it’s the NISPOM security sanitization of the instrument. Its in this document E4401-90513 - Security Features I’ll see if it attaches to my reply It

How about silver solder? Silver is twice as good as aluminum. Mike

The numbers are even worse than I cited. I happened to remember the ratio of thermal resistances for copper and lead was about an order of magnitude, and assumed that lead and solder would have

Then maybe your best choice is to try to purchase some spare boards - can you localize it to a board or two Cheers! Bruce Quoting "tom_iphi via groups.io" <iphi@...>:

Probably should have thought of that B4 hitting send :-) Any possibility of a top side (or less possibly bottom side) heat sink Have you done the thermal analysis and are sure that "fixing" the vias

We been down this road with parts at a former employer , people want more low cost packages that can be automatically placed with means QFN or Laminate packages but thermals are a concern with those

Gotcha ! What I was thinking is to screw down the board on the carrier plate/heat spreader and use a dispensing syringe to fill the holes with copper paste , then use a squeegee to remove the excess

It's incomplete to consider only the length of the thermal path. Lead has over an order of magnitude higher thermal resistance than copper, so its effect would be roughly equivalent to removing over

What I was referring to was the possibility of the paste ending up in places that you don't want and causing leakage/shorts. --Tom -- Prof. Thomas H. Lee Allen Ctr., Rm. 205 350 Jane Stanford Way

No I only put the capton tape on there for masking and removed it after the soldering was done , I also tried to improve the thermal interface between the board and the heat spreader including gap

It's not a big thickness for it to go through though. Maybe your heat up problem is caused by the capton tape? If you can solder to the under side, (maybe with a chisel shaped iron in a metcal heater

Btw I don’t think electrical conductivity is a primary concern as the plating of the vias is carrying the main currents , this is mainly about thermal conductivity Sent: Wednesday, June 1, 2022 3:26

Yes those boards are not going anywhere , the only options I can think of are finding a wat to plug them or cut out the ground slug and use a small gold plated CuBe plate as a “coin” although the

There are different types of thermal vias , for this kind the vias are actually filled with copper and then planarized on top , I have a bare EVB that uses this kind of vias and there are no holes

The problem with solder is that the thermal conductivity of solder sucks

Well, you don't have too many options at this point, so give it a try. You aren't going to be shipping these, I assume. The obvious problem to watch out for is the electrical conductivity of the