i am working on a circuit board design for a X-Band PA , the part is in a QFN package with a ground slug , i put vias in the ground slug as common for ground and thermal reasons and taped off the vias on the bottom side with capton tape to minimize? solder wicking ,? the problem however i run into is that the vias are not providing enough thermal conductivity to ensure the die not exceeding the max temperature ratings.?
the apps engineer states that they recommend copper filled vias or using a coin and on the next round i can surely have the vias plugged but i am looking for a solution to salvage the prototype boards and evaluate the impact of plugged vias .
copper paste of course is available and used as a anti seize agent for car repair shops but the question is whether this kind of paste offers sufficient thermal properties and whether there are any concerns using this for a circuit board ?
