I thought the hole was to be through the circuit board, not the chip itself.? The substrate is silicon which is rather hard.? It has a Mohs hardness of about 7.? Titanium is less hard at 5 to 6 as a comparison.? Tungsten carbide 9.? The silicon wafer is also much harder than regular glass.
You probably not only need something like a diamond drill as mentioned, but perhaps even a means to cool it.
One other thing.? The silicon wafer at the beginning of the semiconductor manufacturing process is about 1 mm thick.? Many wafers, after the devices have been deposited on them, go through a "backgrinding" process to remove much of the silicon wafer to make it thinner.? Then it is sliced up into individual chips and then packaged.? Thinning helps with heat distribution.? (I know this stuff because I was involved in designing semiconducting manufacturing equipment).? Therefore, the substrate might actually be quite thin.
Charles E. "Chuck" Kinzer
On Saturday, March 22, 2025 at 09:15:44 PM PDT, Jon Rus via groups.io <byghtn5@...> wrote:
Perforate the chip with a LASER!
?in a CNC to run a circle pattern
round-and-round to achieve the desired hole size.
On 3/22/2025 2:27 PM, Jacques Savard
via groups.io wrote:
399?/?5?000
?
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I have some cpu 486 or pentium vintage version
?
But impossible to drill a ho;e in the material
Normal drill for Metll Nothing
Drill Diamand for glass or stained glass Nothing
barely trace
Probably epoxy
tre
Do you have an idea please
Jack 47 71
it is exposy proly but very hard stouf
Any Advise Please
