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Looks like a useful technique for SOIC parts, as shown in the picture.
There are many kits that use a few SMD ICs of that size along with
mostly through-hole components. The Softrock series is a good example.
I'm guessing that the picture comes from one of Diz's own kits.

Not as big a help for smaller form factors like TSSOP. They're so
small that they'd be hard to tape down, and the big problem you have
with those is solder bridges between the closely spaced leads. I've
never had much success dealing with TSSOP with a soldering iron and
wire solder; I'll always get out the heat gun and solder paste for
those. I know that some people have made it work by putting down a
bunch of solder and then using solder wick to remove most of it but I
haven't gotten that technique to work.