Dave,
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The minimum energy to cause damage has gone way down over the years as transistor geometries have shrunk, but I don't know specific values. When I started doing chip design, the state of the art was with NMOS FET gates around 9 microns by 9 microns in minimum area. Present CMOS transistor gates (in high density digital circuits) are around 7 nanometers by 7 nanometers minimum. In area, that is more than a million times smaller. RF devices are not normally that small, but you get the idea. Even in a fairly large device, gate oxide damage is usually concentrated in a small weak spot of the overall device, so it doesn't necessarily help a lot if the gate area is large. The usual plan in protecting sensitive circuits is to use things like (relatively) large junction devices to direct ESD currents to supply rails instead of FET gates. These junctions are reverse biased in normal operation, but they still can contribute to distortion problems. --John On Sun, Sep 22, 2019 at 08:25 PM, Dr. David Kirkby from Kirkby Microwave Ltd wrote:
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