On Mon, Nov 11, 2024 at 03:47 PM, Stephan G wrote:
The big advantage is that no significant amount of flux gets underneath the package where it is almost impossible to remove by simlply cleaning with IPA. As some flux residue are becoming hygroscopic over time, having no flux residue on a PCB can be a big advantage if the PCB is used in humid air / outside.
I've used a hot air gun (set to the lowest temperature and high velocity) to try to blow the stuff from under the chip, but I suppose some still remained. An ultrasonic cleaner might be a better solution.
Paul Kanevsky