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As I use my rig mainly in portable situations, I want to try to avoid field failures due to shocks and vibrations.?

I am particularly concerned about the toroid coils and maybe the larger electrolytic capacitors.

I have my finals mounted firmly to a larger heatsink attached to the case so they will be ok.

I have some limits as to how much padding I can add as I want to use the rig /PM as well.?

I have also decided to avoid the extra weight of a "Pelican" style case.

So I have three questions:?

1. Are they other components I should be concerned about?

2. What method so you recommend: hot melt glue, epoxy glue, superglue or other method?

3. What about the cables, I have them bundled at the exit of the connectors wherever I could. Any other actions I should take?

Not wanting to hijack the Bitx40 thread about L2-L3.

Thanks and 73,?

John (VK2ETA)

Hot glue is your best bet.? Poor man's potting to the rescue.? It holds very well and removes easy enough for repairs and upgrades.? Make sure your cable bundles aren't so tight that they are putting stress on the outer cables in the connectors as they bend into the bundle.? No reason you couldn't also hot glue the connectors in place and the wires coming out as a means of strain relief.

On Thu, Apr 5, 2018 at 04:58 am, John wrote:

I want to try to avoid field failures due to shocks and vibrations.?

To mitigate shock and vibration getting to the PCB consider something like LORD Micro-Mounts.



There's a cute little demo video on that page.

I don't know what to expect for pricing or ordering hassles, but here is the distributor page.

Potting with hot glue as suggested will help prevent relative movement between toroids and the board; they are only secured with very thin wire and solder.? The heat sinks on the finals are cantilevered masses that will induce strain at the point where the terminals connect to the board; that's where they will fatigue and ultimately break.? The finals themselves are likely very robust against vibration damage so it might be better to mount the heatsink and finals to the case and use flexible wiring to connect them to the PCB, or to put the heatsink/finals?module on its own isolation mount.? Same idea with the Raduino.

https://www.amazon.com/3M-Scotch-Weld-Epoxy-Potting-Compound/dp/B000X5G6O6/

Thanks you all for your ideas. Much appreciated. I'll post a final picture (well...final until the next mod..hihi).

73, John (VK2ETA)